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斉藤 淳一; 小林 洋平*; 澁谷 秀雄*
no journal, ,
Wettability of pure metal by liquid sodium has been studied in order to control the wettability. In order to understand theoretically the wettability the electronic state of interface between liquid metal and substrate metal calculated and an atomic bonding at interface obtained. Consequently, it became clear that the contact angle which is one of indications of wettability was related with the atomic bonding at interface. An electronic state of interface between liquid low-melting temperature alloy and pure metal was calculated to evaluate the experimental results of wettability of pure metal using the low-melting temperature alloy. And the contact angle was evaluated by the atomic bonding of interface. The molecular orbital calculation was utilized for the calculation of electronic state of interface. The low-melting temperature alloy consists of bismuth, tin and indium. Aluminum, titanium, iron, nickel, copper, zirconium, niobium and molybdenum were selected as the substrate metal. From the calculation result an electronic density of state of interface was similar to that of bulk metal. It means the electronic state of interface was expressed well in this calculation. It became clear that an atomic bonding at interface changed with the atomic number of substrate metal. We will report a relationship between the atomic bonding and the contact angle of wettability in the presentation.
小林 洋平*; 斉藤 淳一; 澁谷 秀雄*
no journal, ,
Wettability is one of properties between liquid and solid material and it is very important factor affecting on acoustic property, corrosion property and so on. In this study, some experiments of wettability of pure metals were performed using the low-melting temperature alloy in order to get many fundamental information of wettability. The low-melting temperature alloy consists of bismuth, tin and indium. Aluminum, titanium, iron, nickel, copper, zirconium, niobium and molybdenum were used as a substrate metal. Test temperature was 353K and test atmosphere was in air. A droplet of the low-melting temperature alloy was put on the substrate metal and a contact angle was measured. From the measurement results, the contact angle changed depending on the substrate metal. It is suggested that the contact angle has relations with the atomic bonding between the s